VORAGO Technologies awarded two NASA Small Business Innovation Research (SBIR) Projects
VORAGO Technologies, a leading provider of radiation-hardened and extreme-temperature embedded systems technology, has been awarded two new NASA Small Business Innovation Research (SBIR) Phase I grants by the National Aeronautics and Space Administration (NASA).
The two projects now underway are consistent with VORAGO’s technology expertise and commercial objectives. VORAGO will create a rad-hard I/O Expansion Chip for next-generation spaceflight processor devices, including the High-Performance Spaceflight Computing (HPSC) Chiplet. The company will also harden an existing proven commercial Flash memory technology that is available from a USA-based Trusted CMOS wafer fab.
VORAGO is also currently engaged in an SBIR Phase II project with NASA to design a radiation-hardened miniaturized system-in-package (SIP). The SIP is optimized for size, weight, power consumption and radiation hardness.
“We are delighted that NASA has selected VORAGO Technologies to undertake these important projects,” said Bernd Lienhard, Chief Executive Officer of VORAGO Technologies. “HARDSIL technology is a perfect solution to quickly and cost-effectively create radiation-hardened semiconductor devices for use in challenging space environments.”
HARDSIL uses standard manufacturing equipment with no negative impact on performance or yields. This approach is a highly cost-effective and fast alternative to conventional rad-hard by design (RHBD) techniques, specialized wafer fabrication processes, up-screened commercial products, redundant systems or mechanical shielding.
VORAGO Technologies will be exhibiting at Space Tech Expo USA 2019 on Booth 8027